Dummy Components and Test Boards
Dummy Components are exact, non-electrical mechanical packages used for pick-and-place machine setup, calibration, process testing, solder training, education and rework practice.
Dummy SMD components are available in all popular IC packages including: Chipscale, µBGA, CSP, Stacked CSP, Chip Array BGA, Ball Grid Array, TapeArray BGA, fleXBGA, SuperBGA, PBGA, fcCSP, Flip Chip Test Die, Quad Flat Pack, QFP, MLF, LQFP, TQFP, LQFP, BQFP, Ceramic Quad Flat Pack, CQFP, LCC, Small Outline, TSOP, TSSOP, SOIC, SOJ, SSOP, ePad, Plastic Leaded Chip Carrier, PLCC, SMR, SMC, SMC lead-free, SMT, SMR, SMTA, SME, melf diodes, through-hole, TO transistors, axial leaded resistors, passives and discrete. Dummy packages are available as small as 0201 and many components are available in lead-free formulations. Test boards are available for hand soldering and machine testing and setup.
![]() PBGA Packages ![]() ![]() Chip Scale Packages ![]() ![]() Quad Packages ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() Passive / Discrete Packages ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() Through-Hole Packages ![]() ![]() Ceramic Packages ![]() ![]() |
![]() New ![]() BGA Packages ![]() ![]() ![]() ![]() Chip Scale Packages ![]() ![]() ![]() Quad Packages ![]() ![]() ![]() SOIC Packages ![]() RFQ |
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