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Flip Chips

Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection from the die to the exterior of the package. The interconnection between die and carrier in flip chip packaging is made through a conductive bump that is placed directly on the die surface. The bumped die is then flipped over and placed face down, with the bumps connecting to the carrier. After the die is soldered, underfill is applied between the die and the substrate, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the difference in thermal expansion between the silicon die and carrier.

Flip Chip Test Boards Amkor Stacked CSP

Part Number		PB18- 250 x 250	PB18- 500 x 500	FA10- 200 x 200	PB08- 200 x 200 PB08- 400 x 400	PST02- 150 x 150
Drawings		See Drawing	See Drawing	See Drawing	See Drawing	See Drawing
Die Size		250 x 250 mils	500 x 500 mils	200 x 200 mils	200 x 200 mils 400 x 400 mils	150 x 150 mils
Bump Pitch		457 µm, 18 mil	457 µm, 18 mil	254 µm, 10 mil	203 µm, 8 mil	457 µm, 18 mil
Passivation Via		102 µm	102 µm	80 µm	73 µm	102 µm
UBM Diameter		152 µm	152 µm	102 µm	95 µm	152 µm
Bump Height		140 µm	140 µm	110 µm	98 µm	130 µm
Bump Diameter		190 µm	190 µm	135 µm	120 µm	160 µm
No. of Bumps		48	96	317	88	21
Max. Bump Diagonal		7.7 mm	16.5 mm	7.9 mm	—	—
Die Metal	Pad Size	193 x 193 µm	193 x 193 µm	127 x 127 µm	115 x 115 µm	165 x 165 µm
	Thickness	12 kA	12 kA	12 kA	12 kA	40 kA
	Type	98/1/1 Al/Cu/Si	98/1/1 Al/Cu/Si	98/1/1 Al/Cu/Si	98/1/1 Al/Cu/Si	98/1/1 Al/Cu/Si
Packaging
Uncut Wafer*		5" Wafer 250 x 250 mils (236 Die)	5" Wafer 500 x 500 mils (46 Die)	5" Wafer 200 x 200 mils (375 Die)	5" Wafer 200 x 200 mils (375 Die) 400 x 400 mils (87 Die)	5" Wafer 150 x 150 mils (694 Die)
Tray		Sawed 5" Wafer 25 per tray 2" sq Waffle Pack	Sawed 5" Wafer 9 per tray 2" sq Waffle Pack	Sawed 5" Wafer 36 per tray 200 x 200 Waffle Pack	Sawed 5" Wafer 36 per tray 200 x 200 9 per tray 400 x 400 Waffle Pack	Sawed 5" Wafer 25 per tray 2" sq Waffle Pack
Tape and Reel		Call For Availability	Call For Availability	Call For Availability	Call For Availability	Call For Availability

• * Die count represents expected yield per wafer.
• All die is packaged in waffle pack trays unless otherwise specified.
• All test wafers are currently 5" diameter and are 0.635mm thick. Passivation is one-micron thick plasma nitride with round via openings.
• The potential multiple is the number of die repeats on the wafer. With the wafer orientated flat down, a right hand coordinate system applies.
• Die size is from scribe line to center-to-center. Scribe width is 0.05mm passivated. Each bump is electrically connected to one other bump and isolated from all others to facilitate electrical test.
• Bump pitch is defined as center-to-center distance between passivation openings.
• Bump height is defined as silicon surface to the top of the bump.
• Bump diameter is defined as the maximum diameter.
• UBM = Under Bump Metallurgy
• Lead-free parts are available.

About Lead-Free Flip Chips

Flip Chips are used in evaluating assembly techniques, board continuity, temperature cycle life test evaluation, underfill processes and other generic Flip Chip evaluations. When using Lead-Free Flip Chips, consideration needs to be given to the appropriate flux, underfill, temperature profile, and pad finish for the assembly. Many companies are developing and qualifying alternative pad finishes such as immersion Sn. Lead-Free Flip Chips address the need for environmentally conscious assemblies as well as Alpha particle tolerant packaging.

Lead-Free Die

• All Flip Chips are available Lead-Free with Alloy LF2 composition 95.5% Sn /3.5% Ag /1.0% Cu.
• When ordering Lead-Free Flip Chips, add “LF2” at end of part number.
• LF2 was introduced by FCT (the acronym is Lead-Free #2). Please call for more details.

Quartz Die

• When ordering Quartz chips, add “Q” at end of part number. For Quartz Lead-Free add “QLF2”.
• Quartz allows customers to observe underfill processes. Please call for more details.
• All Flip Chips are available in “Quartz” with eutectic solder bumps or Lead-Free.