S-CSP Stacked CSP
| Amkor’s Stacked
CSP packages leverage existing CABGA manufacturing capabilities
and proven package infrastructure while adding the enhancement of
placing one die on top of another.
Stacked CSP packages combine the use of thin core substrate material, wafer backgrinding know-how (to 7 mils), and conventional BGA surface mount techniques. This technology allows for very efficient use of motherboard real estate, reducing size and weight and supporting the customer's system level cost reduction needs. |
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Flip Chips |
| Part Number | I/O Count | Pitch | Body Size |
Ball Matrix |
Quantity Per Tray |
| A-CSP72-.8mm-8x10mm | 72 | .8mm | 8 x 10mm | 8 x 12 | 220 |
| A-CSP72-.8mm-8x11mm | 72 | .8mm | 8 x 11mm | — | |
| A-CSP72-.8mm-8x12mm | 72 | .8mm | 8 x 12mm | — |
- Low profile package height (1.4mm max.)
- Flash/SRAM combination with up to 72 I/O.
- Established package infrastructure with standard CABGA footprints.
- Consistent product performance and reliability.
- JEDEC MO-219 Standard Outlines.
- Moisture resistance testing JEDEC Level 3 @ 240 °C
