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SBGA SuperBGA® Super Ball Grid Array 1.27mm SuperBGA® Package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heat sink. Since the IC and the I/O are on the same side, signal vias are eliminated.

Part Number	I/O Count	Pitch	Body Size	Ball Matrix	Ball Alignment	Quantity Per Tray
A-SBGA168-1.27mm-23mm	168	1.27mm	23mm	17 x 17	Perimeter	60
A-SBGA256-1.27mm-27mm	256	1.27mm	27mm	20 x 20	Perimeter	40
A-SBGA304-1.27mm-31mm	304	1.27mm	31mm	23 x 23	Perimeter	27
A-SBGA352-1.27mm-35mm	352	1.27mm	35mm	26 x 26	Perimeter	24
A-SBGA432-1.27mm-40mm	432	1.27mm	40mm	31 x 31	Perimeter	21
A-SBGA520-1.27mm-40mm	520	1.27mm	40mm	31 x 31	Perimeter	21
A-SBGA560-1.27mm-42.5mm	560	1.27mm	42.5mm	33 x 33	Perimeter	12
A-SBGA600-1.27mm-45mm	600	1.27mm	45mm	35 x 35	Perimeter	12

See Cross Section Drawing and Solder Information

• Superior thermal performance.
• Light weight
• Low profile (1.4mm mounted)
• Moisture resistant (JEDEC level 3)
• JEDEC MO-192 standard outlines
• Enhanced electrical performance > 1 GHz
• Parts are packaged in JEDEC trays.
• Call for tape and reel quantity and availability.
• Solder ball material is eutectic 63/37 SnPb.
• BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
• Parts can be baked and dry-packed.
• All components are daisy-chained except for 520 I/O.