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Flip Chip Test Die Kits

With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip chip type components become a compelling technology for potential users. Flip Chip Technology test die are combined with factory designed test boards to provide customers the ability to test a variety of die specs, bump pitches and bump counts. Both components and test boards are daisy-chained for continuity.

Flip Chips

FB250 and FB500 Board and Kits

Laminate Board
Laminate board is double-sided board. One side has 10 pads for the FB250, the other side has 10 pads for the FB500.

Substrate Information
Board Type—High Temp FR4 (Tg = 176 °C); Board Thickness— 0.031" or 0.062"; Layers— 4 (top, bottom, ground, power) inner layers nonfunctional; Copper Conductor— 1 oz. Cu; Solder Mask— Taiyo PSR-4000; Test Site Die— 10 (250 x 250 mil2) sites on one side of the board; Pitch— 18 mil; Minimum Line— 6 mil; Maximum Space— 12 mil; Test Site Die— 10 (500 x 500 mil2) sites on one side of the board; Pitch— 18 mil; Minimum Line— 6 mil; Maximum Space— 12 mil.

Order Number: FB250/500 Laminate PCB

FB250 Kits

Part Description	Quantity Per 1 Kit	Quantity Per 5 Kits	Quantity Per 10 Kits	Quantity Per 15 Kits	Quantity Per 20 Kits
FB250-DC	10	50	100	150	200
FB250/500 Laminate	1	5	10	15	20
Kit Order Number:	FB250-001	FB250-005	FB250-010	FB250-015	FB250-020

FB500 Kits

Part Description	Quantity Per 1 Kit	Quantity Per 5 Kits	Quantity Per 10 Kits	Quantity Per 15 Kits
FB500-DC	10	50	100	150
FB250/500 Laminate	1	5	10	15
Kit Order Number:	FB500-001	FB500-005	FB500-010	FB500-015

The FB250/500 Laminate board is double sided with 10 pads on each side. 10 pads for the FB250 and 10 pads for the FB500.
Lead-free parts are available.

PB8-200x200 Board and Kits

Board size
3.5" x 5.5"

Laminate Board
Laminate board is double-sided. One side has 10 pads for the PB8-2x2 (back side is no longer available for the PB8-4x6, this part has been discontinued).

Ceramic Board
Ceramic board is not available.

Substrate Information
Board Type— High Temp FR4; Board Thickness— 0.062"; Layers— 4 (top, bottom, ground, power) inner layers nonfunctional; Copper Conductor— 1/4 oz. or 1/2 oz. Cu; Solder Mask— Taiyo PSR-4000; Test Site Die— 10 (200 x 200 mil2) sites on one side of the board; Pitch— 8 mil; Minimum Line— 4mil; Minimum Space— 4 mil; Wettable Cu Pad— 4 x 8 mil2 (defined using a solder mask); Purpose— Flip Chip on FR-4 board with daisy-chain structure.

Order Number: PB8-2x2-Laminate PCB

PB8-200x200 Kits

Part Description	Quantity Per 1 Kit	Quantity Per 5 Kits	Quantity Per 10 Kits
FA10-200x200-DC	10	50	100
FA10 Laminate	1	5	10
Kit Order Number:	FA10-2x2-001	FA10-2x2-005	FA10-2x2-010

FA10-200x200 Board and Kits

Board size
3.5" x 5.5"

Laminate Board
Laminate is only available for FA10-2x2. Single-sided pattern.

Ceramic Board
Ceramic is not available.

Substrate Information
Board Type— High Temp FR4; Board Thickness— 0.031"; Layers— 4 (top, bottom, ground, power) inner layers nonfunctional; Copper Conductor— 1/4 oz. or 1/2 oz. Cu; Solder Mask— Taiyo PSR-4000; Test Site Die— 10 (200 x 200 mil2) sites on one side of the board; Pitch— 10 mil array; Minimum Line— 4 mil; Minimum Space— 4 mil; Wettable Cu Pad— 5 mil diameter, round; Through-Hole Via— 8 mil drill, 10 mil; capture pad.

Order Number: FA10-2x2-PCB

FA10-200x200 Kits

Part Description	Quantity Per 1 Kit	Quantity Per 5 Kits	Quantity Per 10 Kits	Quantity Per 15 Kits	Quantity Per 20 Kits
PB8-200x200-DC	10	50	100	150	200
PB8 Laminate Board	1	5	10	15	20
Kit Order Number:	PB8-2x2-001	PB8-2x2-005	PB8-2x2-010	PB8-2x2-015	PB8-2x2-020

The FA10 Laminate board is single sided.

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