MLF™ MicroLeadFrame™
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Amkor’s MicroLeadFrame™ Package is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor’s ExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. |
  
MLF
Test Kits |
| Part Number | Lead Count | Body Size | Pitch | Quantity Per Tube |
| .4mm Pitch | ||||
| A-MLF100-12mm-.4mm | 100 | 12mm | .4mm | 25 |
| .5mm Pitch | ||||
| A-MLF8-2x3mm-.5mm | 8 | 3 x 2mm | .5mm | 155 |
| A-MLF12-3mm-.5mm | 12 | 3mm | .5mm | 100 |
| A-MLF16-3mm-.5mm | 16 | 3mm | .5mm | 100 |
| A-MLF20-4mm-.5mm | 20 | 4mm | .5mm | 75 |
| A-MLF24-4mm-.5mm | 24 | 4mm | .5mm | 75 |
| A-MLF28-5mm-.5mm | 28 | 5mm | .5mm | 60 |
| A-MLF32-5mm-.5mm | 32 | 5mm | .5mm | 60 |
| A-MLF36-6mm-.5mm | 36 | 6mm | .5mm | 50 |
| A-MLF40-6mm-.5mm | 40 | 6mm | .5mm | 50 |
| A-MLF44-7mm-.5mm | 44 | 7mm | .5mm | 43 |
| A-MLF48-7mm-.5mm | 48 | 7mm | .5mm | 43 |
| A-MLF52-8mm-.5mm | 52 | 8mm | .5mm | 37 |
| A-MLF56-8mm-.5mm | 56 | 8mm | .5mm | 37 |
| A-MLF60-9mm-.5mm | 60 | 9mm | .5mm | 33 |
| A-MLF64-9mm-.5mm | 64 | 9mm | .5mm | 33 |
| A-MLF68-10mm-.5mm | 68 | 10mm | .5mm | 30 |
| .65mm Pitch | ||||
| A-MLF8-3mm-.65mm | 8 | 3mm | .65mm | 100 |
| A-MLF16-4mm-.65mm | 16 | 4mm | .65mm | 75 |
| A-MLF20-5mm-.65mm | 20 | 5mm | .65mm | 60 |
| A-MLF28-6mm-.65mm | 28 | 6mm | .65mm | 50 |
| A-MLF32-7mm-.65mm | 32 | 7mm | .65mm | 43 |
| A-MLF40-8mm-.65mm | 40 | 8mm | .65mm | 37 |
| A-MLF44-9mm-.65mm | 44 | 9mm | .65mm | 33 |
| .8mm Pitch | ||||
| A-MLF4-3mm-.8mm | 4 | 3mm | .8mm | 100 |
| A-MLF12-4mm-.8mm | 12 | 4mm | .8mm | 75 |
| A-MLF16-5mm-.8mm | 16 | 5mm | .8mm | 60 |
| A-MLF20-6mm-.8mm | 20 | 6mm | .8mm | 50 |
| A-MLF28-7mm-.8mm | 28 | 7mm | .8mm | 43 |
| A-MLF32-8mm-.8mm | 32 | 8mm | .8mm | 37 |
- Pin counts and body sizes change on an ongoing basis. Please call for updated listing of available packages.
- Body sizes ranging from 2 x 3mm to 10 x 10mm.
- Solder plating is 85/15 Sn/Pb.
- MLF package is a near CSP plastic encapsulated package with a copper leadframe substrate.
- Parts are packaged in tubes or in trays.
- Small size (50% space reduction as compared with TSSOP).
- 0.75 ± 0.9mm mounted height.
- All lead frames are silver plated.
- MLFs are available daisy-chained (please call for more details)
