MLF™ Test Kits
This new MicroLeadFrame™ (MLF) Test Board is two test boards in one. The front side of the board consists of daisy-chained MLF pads. Amkor’s new MLF packages are a near CSP plastic encapsulated package with a copper leadframe substrate. MLF packages have perimeter pads on the bottom of the package. Thermal enhancement is provided by Amkor’s ExposedPad™ technology. The test board has land patterns for MLF package sizes of 2x3mm to 10x10mm in varying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and 0.8mm. Pitch sizes between the pads on the board are 0.65mm and 0.5mm. The MLF side of the PCB007 Board is designed to help customers become more familiar with the placement and process characteristics of MLF packages. The wide assortment of pad sizes and pitches provide a comprehensive overview of MLF packages. Daisy-chain patterns on the PCB007 board complement the patterns on the components, allowing continuity to be tested.
The bottom side of the PCB007 Test board provides a variety of SMD component types. The bottom of the board has LQFP components with 0.4mm pitch and 0.3mm pitch, pads for the PBGA256 component with a 1.00mm pitch and two TSOP Type II components, the TSOP54 with a 0.8mm pitch and the TSOP86 with a 0.5mm pitch. Standard board finish for the PCB007 is Alpha Level Silver Flash. Other finishes are available upon request. Standard thickness is 0.062". Customers always have the option of mixing and matching components to suit their requirements.
|Board size 8" x 5.5"||
|Part Description||Quantity Per
|PCB007 Test Board||1||5||10||20||50|
|Kit Order Number:||PC007-0-01||PC007-0-05||PC007-0-10||PC007-0-20||PC007-0-50|
Order Numbers for Individual Items
|Part Description||Part Number|
|PCB007 Test Board||15785|
- Kit quantities are subject to change.
- Mix and match components and quantities to create a custom kit. Please contact your sales representative for details.
- Components supplied in kits have pairs of leads shorted together in a daisy-chain pattern that result in a line of continuity when combined with the shorted pairs of pads on the board. Continuity test pads on the board allow the end user to verify the solder connections.
- Gerber and X, Y Theta data included at no charge.