fleXBGA®
| The fleXBGA®
package incorporates the most advanced assembly processes and
designs to offer the highest I/O density solutions for a wide range of
applications. It utilizes a die-up, wirebonded configuration with a
flexible circuit substrate and an over-molded body.
The fine line features of the tape substrate offer reduced conductor and wirebond finger pitch. The fleXBGA® has a near chip scale package (CSP) outline with ball pitches extendible from 1.0mm to 0.65mm. |
  
BGA Fine Pitch Kits |
| Part number | I/O Count | Pitch | Body Size | Ball Matrix | Ball Alignment |
Quantity Per Tray |
| .65mm Pitch | ||||||
| A-fleXBGA232-.65mm-12mm* | 232 | .65mm | 12mm | — | — | 198 |
| .8mm Pitch | ||||||
| A-fleXBGA132-.8mm-12mm* | 132 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| A-fleXBGA144-.8mm-12mm* | 144 | .8mm | 12mm | 13 x 13 | Perimeter | 198 |
| A-fleXBGA160-.8mm-12mm | 160 | .8mm | 12mm | 13 x 13 | Perimeter | 198 |
| A-fleXBGA180-.8mm-12mm* | 180 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| A-fleXBGA208-.8mm-15mm* | 208 | .8mm | 15mm | 17 x 17 | Perimeter | 126 |
| A-fleXBGA280-.8mm-16mm | 280 | .8mm | 16mm | 19 x 19 | Perimeter | 126 |
| 1.0mm Pitch | ||||||
| A-fleXBGA196-1.0mm-15mm | 196 | 1.0mm | 15mm | 14 x 14 | Full Array | 126 |
| A-fleXBGA484-1.0mm-23mm* | 484 | 1.0mm | 23mm | 22 x 22 | Full Array | 60 |
| A-flexBGA672-1.0mm-27mm* | 672 | 1.0mm | 27mm | 26 x 26 | Full Array | 40 |
See fleXBGA Cross-Section
and Solder Information
- * = DC Available.
- Parts are packaged in JEDEC-trays when available.
- Some components are available daisy-chained (please call for more details).
- Solder ball material is Eutectic 63/37 SnPb.
- 1.1mm mounted height for 1.0 and 0.8mm pitch.
- 1.0mm mounted height for 0.65mm pitch.
- Package substrate: Conductor Cu/Ni/Au Dielectric Polyimide.
- 132 to 672 ball counts.
- 12 to 27mm sq. body sizes.
- JEDEC MO-195 outline (JEDEC standardization activity pending).
- EDEC MO-216/A for 0.8mm pitch.
- Lead-free parts are available.