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4. ePad™ TSSOP

ePad™ TSSOP ExposedPad™ Thin Shrink Small Outline Package ExposedPad™ TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages, which can increase heat dissipation by as much as 150%.

TSSOP

Part Number	Number of Pins	Body Width	Pitch	Tape Width	Tape Pitch	Quantity Per Tube	Quantity Per Reel
A-ePadTSSOP8T-4.4mm	8	4.4mm	.65mm	12/16mm	8mm	100	1,000/2,500
A-ePadTSSOP14T-4.4mm	14	4.4mm	.65mm	12/16mm	8mm	96	1,000/2,500
A-ePadTSSOP16T-4.4mm	16	4.4mm	.65mm	12/16mm	8mm	96	1,000/2,500
A-ePadTSSOP20T-4.4mm	20	4.4mm	.65mm	16mm	8/12mm	74	1,000/2,500
A-ePadTSSOP28T-4.4mm	28	4.4mm	.65mm	16mm	8/12mm	50	1,000/2,500
A-ePadTSSOP28T-6.1mm	28	6.1mm	.65mm	24mm	12mm	50	1,000
A-ePadTSSOP56T-6.1mm	56	6.1mm	.50mm	24mm	12mm	35	1,000

• Solder plated exposed metal die pad.
• Highly conductive copper leadframe.
• Up to 60% improvement in Theta JA (compared to standard TSSOP).
• Standard body thickness is 0.90mm.
• Overall height is 1.1mm
• Tube quantity may vary.
• Tape type is plastic.