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Lead Free Solder Sn99 (SAC305)

99.3% tin and 0.7% copper

M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.

If your products might enter Europe, you must ensure they are RoHS compliant now. If your products are sold in California, you must ensure they are compliant by January 1, 2007. Products containing lead solder will not comply. To read more on this issue visit our RoHS Issue AppGuide

Features / Benefits

  • Lead free
  • Complies with RoHS
  • Exceeds the impurity requirements of J-Std-006
  • No Clean flux
  • 21 Gauge, 0.032" diameters
  • Excellent wettability
  • Hard non-conductive residues

Flux Percentage

M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.

Flux Core

A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, please visit the following link for a list of Flux Removers.


  Test Method Specification
Cu content   0.3-0.7 %
Sn content   Balance
Flux Classification JSTD-004 REL0
Copper Mirror IPC-TM-650 2.3.32 No removal of copper film
Silver Chromate IPC-TM-650 2.3.33 Pass
Corrosion IPC-TM-650 2.6.15 Pass
SIR JSTD-004,Pattern Down IPC-TM-650 2.33 x 10 11 ohms
SIR Bellcore (Telecordia) Bellcore GR-78-CORE 13.1.3 6.12 x 10 11 ohms
Electromigration Bellcore GR-78-CORE 13.1.4 Pass
Post Reflow Flux Residue TGA Analysis 55%
Acid Value IPC-TM-650 2.3.13 190-210
Flux Residue Dryness IPC-TM-650 2.4.47 Pass
Spitting of Flux-Cored Solder IPC-TM-650 2.4.48 0.3%
Solder Spread IPC-TM-650 2.4.46 130 mm2


Lead free/leaded solder comparison Lead Free Solder (Sn/Ag/Cu) Sn63/Pb37 (Leaded Solder)
Melting Point 227 ºC (441 ºF) 183 ºC (361.4 ºF)
Wire Diameter 0.032” (0.81 mm) 0.032” (0.81 mm)
Std. Wire Gauge 21 21
Tolerance, in. +/- 0.002” +/- 0.002”
Hardness, Brinell 9HB 14HB
Coefficient of Thermal Expansion Pure Sn=23.5 24.7
Tensile Strength 3190 psi 4442 psi
Density 7.31 g/cc 8.42 g/cc
Electrical Resistivity 10 - 15 µohm-cm 14.5 µohm-cm
Electrical Conductivity 13 % IACS 11.9 % IACS
Yield Strength, psi 2180 3950
Total Elongation,% 39 48
Joint Shear Strength, at 0.1mm/min 20ºC 23 14
Creep Strength, N/mm2 at 0.1mm/min 20ºC 8.6 3.3
Creep Strength, N/mm2 at 0.1mm/min 100 C 2.1 1


Part Number Mfr. Part # Sizes Available Description
MG-4901-112G 4901-112G 1/4 lb (112 g) Spool
MG-4901-227G 4901-227G 1/2 lb (227 g) Spool
MG-4901-454G 4901-454G 1 lb (454 g) Spool
MG-4901-2LB 4901-2LB 2 lb (907g) Bar
Quick Links


RoHS AppGuide

MG RoHS Compliance letter

Related products:
Copper Clad Boards
Liquid Flux
Sn99 Lead Free Solder


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