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Lead Free Solder Sn96 |
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96.3% tin, 0.7% copper and 3% silver
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu
(Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and
Lead solder. These alloys conform to the impurity requirements of J-Std-006 and
RoHS. Use this solder anywhere you would use normal solder.
| If your products might enter Europe, you must ensure they
are RoHS compliant now. If your products are sold in California, you must
ensure they are compliant by January 1, 2007. Products containing lead
solder will not comply. To read more on this issue visit our RoHS Issue
AppGuide |
Features / Benefits
- Lead free
- Complies with RoHS
- Exceeds the impurity requirements of
J-Std-006
- No Clean flux
- 21 Gauge, 0.032" diameters
- Excellent
wettability
- Hard non-conductive residues
- 1 lb of lead free solder has 27%
more length than leaded solder
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art
automatic wire extrusion and wire drawing machines to manufacture consistent
solder. The introduction of flux core in the wire extrusion process involves
constant monitoring of flux percentage to ensure minimal flux voids and
irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead
free alloys. It provides the fluxing activity levels that promote fast wetting
action and maximum wetting spread. Utilizing synthetically refined resin and
very effective activator that wets and spreads like an RA type. This special
activator exhibits virtually no spattering. Activator conforms to J-STD-004,
REL0.Cleaning Flux core is a no clean formulation therefore the residues do not
need to be removed for typical applications. If residue removal is desired,
please visit the following link for a list of Flux
Removers.
Specifications
| |
Test Method |
Specification |
| Ag content |
|
2.8-3.2% |
| Cu content |
|
0.3-0.7 % |
| Sn content |
|
Balance |
| Flux Classification |
JSTD-004 |
REL0 |
| Copper Mirror |
IPC-TM-650 2.3.32 |
No removal of copper film |
| Silver Chromate |
IPC-TM-650 2.3.33 |
Pass |
| Corrosion |
IPC-TM-650 2.6.15 |
Pass |
| SIR JSTD-004,Pattern Down |
IPC-TM-650 2.6.3.3 |
2.33 x 10 11 ohms |
| SIR Bellcore (Telecordia) |
Bellcore GR-78-CORE 13.1.3 |
6.12 x 10 11 ohms |
| Electromigration |
Bellcore GR-78-CORE 13.1.4 |
Pass |
| Post Reflow Flux Residue |
TGA Analysis |
55% |
| Acid Value |
IPC-TM-650 2.3.13 |
190-210 |
| Flux Residue Dryness |
IPC-TM-650 2.4.47 |
Pass |
| Spitting of Flux-Cored Solder |
IPC-TM-650 2.4.48 |
0.3% |
| Solder Spread |
IPC-TM-650 2.4.46 |
130 mm2 |
| Lead free/leaded solder comparison |
Lead Free Solder (Sn/Ag/Cu) |
Sn63/Pb37 (Leaded Solder) |
| Melting Point |
227 ºC (441 ºF) |
183 ºC (361.4 ºF) |
| Wire Diameter |
0.032” (0.81 mm) |
0.032” (0.81 mm) |
| Std. Wire Gauge |
21 |
21 |
| Tolerance, in. |
+/- 0.002” |
+/- 0.002” |
| Hardness, Brinell |
9HB |
14HB |
| Coefficient of Thermal Expansion |
Pure Sn=23.5 |
24.7 |
| Tensile Strength |
3190 psi |
4442 psi |
| Density |
7.31 g/cc |
8.42 g/cc |
| Electrical Resistivity |
10 - 15 µohm-cm |
14.5 µohm-cm |
| Electrical Conductivity |
13 % IACS |
11.9 % IACS |
| Yield Strength, psi |
2180 |
3950 |
| Total Elongation,% |
39 |
48 |
| Joint Shear Strength, at 0.1mm/min 20ºC |
23 |
14 |
| Creep Strength, N/mm2 at 0.1mm/min 20ºC |
8.6 |
3.3 |
| Creep Strength, N/mm2 at 0.1mm/min 100 C |
2.1 |
1 |
| Thermal Conductivity, |
58.7 W/m * K |
50.9 W/m * K |
| Part Number |
Mfr. Part # |
Sizes Available |
Description |
| MG-4900-35G |
4900-35G |
35g (1.2 oz) x 25 |
Pocket pack (box of 25) |
| MG-4900-112G |
4900-112G |
1/4 lb (112 g) |
Spool |
| MG-4900-227G |
4900-227G |
1/2 lb (227 g) |
Spool |
| MG-4900-454G |
4900-454G |
1 lb (454 g) |
Spool |
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