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to CTBGA ChipArray Thin Core Ball Grid Array
| Package Pitch | A | B | C | D |
| 1.0/0.8mm | 0.46mm | 0.48m (±0.05mm) | 0.36mm (±0.05mm) | 0.30mm (±0.05mm) |
| 0.75mm/0.5mm | 0.30mm | 0.32mm (±0.50mm) | 0.19mm (±0.05mm) | 0.17mm (±0.03mm) |
Note: Typical motherboard non-solder mask defined pad:
- 0.50 pitch = 0.28
- 0.80 pitch = 0.30
- 1.00 pitch = 0.38