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to PBGA Plastic Ball Grid Array
| Package | Pitch | Solder Ball Diameter (A) | Solder Ball Land On Package and Board | Solder Ball Height on Package (B) | Solder Joint Height After SMT* (C) |
| (1)PBGA | 1.00 | 0.50 | 0.45 | 0.40 | 0.32 |
| (2)PBGA | 1.00 | 0.63 | 0.45 | 0.55 | 0.48 |
| PBGA | 1.27 | 0.76 | 0.63 | 0.60 | 0.52 |
| PBGA | 1.50 | 0.76 | 0.63 | 0.60 | 0.52 |
- Units = mm
- Assumptions: 5 mils solder paste; Solder mask defined pad
- (1) Applies to 13, 15 and 17mm packages
- (2) Applies to 23, 27, 31 and 35mm packages