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TV-208 Notes
- 2–metal utilizes substrate enabling high density and high performance.
- Small chip-size footprint and low profile enables small form factor solutions.
- No under-fill is needed, providing the option to rework.
- JEDEC level 1 moisture resistance eliminates the need for special packaging and handling.
- Unique compliant layer relieves thermo-mechanical stress providing superior reliability.
- Exposed back surface of the die provides excellent thermal junction for efficient thermal management.
- Short lead length provides excellent electrical characteristics.
- Lightweight for portable designs.
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