Non-Silicone Heat Transfer Compound

• Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
• High efficient thermal conductive properties
  • Means more rapid transfer of heat for longer component life
• High temperature stability
  • Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
• Uses synthetic fluids and metal oxide fillers
  • Provides excellent conductive properties that exceed those of other heat sink formulas
• Will not dry, harden, melt or migrate in any heat sink application
• Compatible with metal and plastic components
• Meets MIL-DTL-47113D
• Also available in a silicone version

Benefits of Non Silicone Heat Transfer Compound OVER Silicone

No migration and component contamination.

Applications

• Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
• Other used:
• Semiconductor Mounting Devices
• Thermal joints
• Ballast heat transfer mediums
• Power resistor mountings
• Thermocouple wells
• Transistor diodes & silicone rectifier base and mounting studs
• ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required

Specifications