|
Silicone Heat Transfer Compound |
 |
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden `
- Contains zincs oxides and polydimenthyl siloxane
- Meets MIL-DTL-47113D
- Non-silicone version available
Designed for use in transferring heat away from electrical and electronic
devices such as; transistors, power diodes, semi-conductors, ballast's and
thermocouple wells. High thermal conductivity, high dielectric constant, high
dissipation factor, use with heat sinks or metal chassis, will not dry or
harden. Contains zinc oxide and polydimethyl siloxane.
Specifications
| Physical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Appearance |
Visual |
Off white / smooth paste |
White paste |
| Consistency |
ASTM D 217 |
310-320 |
|
Specific Gravity
@ 25°C (77°F) |
|
2.5 min |
2.3 min |
Bleed %
24 hours @ 200°C |
FTM-321 |
1.0% max |
2.0% max |
Bleed %
24 hours @ 200°C |
FTM-321 |
1.0% max |
2.0% max |
Evaporation
24 hours @ 200°C |
ASTM D-566 |
> 500°F (260°C) |
|
| Max. operating temp. |
|
200°C |
200°C (consistent)
300°C intermittent |
| Electrical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Thermal Conductivity |
Hot Wire Method Heat Flow #36 °C |
18.48 x 10-4 (K Factor, Cal/Sec cm•K |
0.657 W/m•K |
Dielectric Strength
(0.05l gap) |
ASTM D-149 |
350 V/MIL |
400 V/MIL |
| Dielectric Constant @ 1000 Hz |
ASTM D- 150 |
4.4 |
3.81 |
Dissipation Factor
@ 1000 Hz |
ASTM D 150 |
0.0021 |
0.0032 |
| Resistivity @ 21°C |
ASTM D 150 |
6.38 x 1013 Ohm/cm |
1.5 x 1015 Ohm/cm |
| Part Number |
Mfr. Part # |
Sizes Available |
Description |
| MG-860-4G |
860-4G |
4g x 100 |
Pail of 100 singles |
| MG-860-60G |
860-60G |
60g (2 oz) |
Jar |
| MG-860-150G |
860-150G |
150g (5 oz) |
Tube |
| MG-860-1P |
860-1P |
1 pint (2.5 lbs) |
Tub |
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