Non-SiliconeApply this release to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins.
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Part Number | Description | Price USD |
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| MG-8329-350G | MOULD RELEASE (NON-SILICONE), 12.3 oz | Get quote |
Get quote - Special Order. Please e-mail or fax at 570.842.4290 for pricing.