Bomir online Worldwide Distribution Network For SMT, LVA, and ESD Equipment View Shopping Cart USA
Phone: 570 842-4725
Fax: 570 842-4290
Cart: (Empty)

Quick Search

sale_bomir.jpg

AW75-BK.jpg

Antistatic Wheels

High Temperature Epoxy Encapsulating and Potting Compound

For encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.

Features / Benefits

  • Extreme physical strength and chemical resistance
  • Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
  • Protects against strong vibrations, abrasions, and direct physical impact
  • Extremely difficult to remove - grants incredible technology protection
  • Maximum service temperature of 275°C (527°F)

Typical Applications

  • Use in electronic assemblies to prevent vibration damage
  • Encapsulate circuits for the purpose of technological protection

Specifications

Cured Properties - Physical Test Method Result

Viscosity at 20 ºC (68 ºF) (Part A)

54,800 cps

Viscosity at 20 ºC (68 ºF) (Part B)

11,000 cps

Mixed Viscosity at 20 ºC (68 ºF)

40,000 cps

Mixing Ratio by Volume

2.0 : 1.0
(Part A: Part B)

Mixing Ratio by Mass

2.186 : 1.000
(Part A: Part B)

Maximum Service Temperature

275 ºC (527 ºF)

Maximum Intermittent Temperature

300 ºC (572 ºF)

Working Time (100 gram sample)

1 hour

Cure time at 20 ºC (68 ºF)

24 hours

Cure time at 65 ºC (149 ºF)

1 hour

Hardness, Shore D

80

Tensile Strength

ASTM-D-638-02a

7,861 PSI

Elongation

ASTM-D-638-02a

3.38%

Compressive Strength

ASTM-D-695-02a

11,870 PSI

Flexural Strength

ASTM-D-790-03

14,600 PSI

Flexural Modulus

ASTM-D-790-03

399,000 PSI

Lap Shear Strength

ASTM-D-1002-01

1,794 PSI

Coefficient of Thermal Expansion

ASTM-D-648-01

 

-40 ºC to 50 ºC 75.7x10-6 mm/mmºC
+100 ºC to +250 ºC

154.0x10-6 mm/mmºC

-40 ºC to +250 ºC

125.3x10-6 mm/mmºC

+25 ºC to + 250 ºC

140.2x10-6 mm/mmºC

Deflection Temperature Under Load

ASTM-D-648-01

53.9 ºC (129.02 ºF)

Dielectric Constant

ASTM-D-150-98

4.24 @ 60 Hz

Dissipation Factor

ASTM-D-150-98

0.0018 @ 60 Hz

Volume Resistivity

ASTM-D-257-99

9.3 x 1015 ohm · cm

Surface Resistivity

ASTM-D-257-99

5.3 x 1013 ohm

Dielectric Strength

ASTM-D-149-97a

1,138 volts / mil ! 0.020”

Thermal Conductivity

ASTM-E-1530-99

0.210 W/mºK

Thermal Conductivity @ 25 ºC (77ºF)

ASTM-E-1461-92

0.218 W /mºK

Thermal Diffusivity @ 25 ºC (77 ºF)

ASTM-E-1461-92

1.33 x 10-13 M2/s

Specific Heat Capacity @ 25 ºC (77 ºF)

ASTM-E-1269-01

1419 J/kgºK

 

Part Number Sizes Available Description
832HT-375ML 375ml (12 oz) Liquid
832HT-3L 3L (0.8 gal) Liquid
Quick Links

MSDS Black Part A
MSDS Black Part B

AppGuide

 

 

  |  Print page

 

Order Now Part Number Description Price
USD
MG-832HT-375ML HIGH TEMPERATURE EPOXY ENCAPSULATING AND POTTING COMPOUND, 12 oz
Qty1 +
Price$53.95
MG-832HT-3L HIGH TEMPERATURE EPOXY ENCAPSULATING AND POTTING COMPOUND, 0.8 gal
Qty1 +
Price$245.00