X-REFLOW305 HT-LF Full Convection,
Bench Top, Batch oven with Nitrogen Connections
Especially designed for LEAD FREE Soldering
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High performance, inexpensive reflow batch oven for use in small lot production and laboratory simulation tests. The X-REFLOW is a high performance reflow batch oven designed for reflow simulation, heat-resistant testing and small lot production. With its large back light LCD display the setting of the temperature and time or the operation, can be easily checked by numerical value or graph. |
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FEATURES
- HIGH OPERATING TEMPERATURE for LEAD FREE SOLDERING
Higher than other ovens max. operating temperature 350 °C (662 °F) and better, stronger materials to assure good performance when soldering with lead free alloys - HIGH PERFORMANCE, INEXPENSIVE
The X-REFLOW305 HT-LF is an inexpensive high performance production reflow batch oven. This unit has several unique features, which enhance operation and provide the use with every possible aid. - SMALL DESKTOP SIZE
It has a small foot print and weights only 43kg. Conventional ovens are large in size, but the X-REFLOW305 HT-LF can fit on top of one desk in a small room. - LARGE GLASS VIEWING WINDOW
The large glass viewing window 280x280 mm allows the inside reflow condition to be checked easily. Users can see the oven's inside directly, check and photograph the detail soldering condition by using a microscope, a small CCD camera. - LARGE BACK LIGHT LCD DISPLAY WITH DIGITAL AND GRAPHIC
PROFILE INFORMATION
The large back light LCD display allows easy inputting and checking of the profile. One button can change the operation temperature profile on the graph display and allows checking of the operation conditions at a glance. Depending on the working area the LCD display brightness can be adjusted by the contrast adjustment knob making is easy to see. - CAPACITY TO STORE UP TO 255 PROFILES
The four operation processes, preheat 1-3 and reflow, temperature and time are set separately, allowing up to 255 profiles to be stored. To adapt to the PCB size and mounting density, control temperature of the front and back hot wind output opening can be adjusted. The reflow of multi layer PCBs can be done for various small lot production. - TIME ZONE LED (OPERATION LAMP)
The front side time zone LEDs allow operation to be checked at a glance. - N2 PORT
To decrease the oxidation of leads and pads during soldering, compressed N2 gas source can be connected to the oven to replace the air (oxygen). - MANAGEMENT KEY
This oven has a management key. If this key is not used, the oven cannot be operated.
Technical Specifications
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X-REFLOW305 HT-LF |
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| Reflow area |
12" x 12" x 1.75" |
| Minimum cooling temperature |
150°C |
| Maximum temperature setting |
350°C |
| Heaters |
2 Heaters x 2,4kW Each |
| Max. PCB size |
12" x12" (305x305 mm) |
| Max current draw |
21 A, |
| Size |
L=480mm x W=711mm x H=200mm |
| Weight |
88 lbs. (40 kg) |
| Computer profile control |
Allows creation, storage and recall of up to 255 |
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Part Number | Description | Price USD |
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| TRX-7122 | Standard Cutters, Long Ergonomic Handle, Oval Relief, Flush |
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