- Product Brands
- SMT by X-KAR
- SMT Rework/Repair
- Vacuum Pick-Up Solution
- XCP-01
XCP-01
Semi-Automatic Vacuum Pick-up
Semi-Automatic Vacuum Pick-up conveniently lifts the component
upon re-flow of solder during de-soldering of SMT components. Semi
automatic pick up prevents unnecessary heating of the solder
connections and the parts on the board when solder is already
molten. This System increases efficiency and reliability of rework. When used with SMT-ServiCE the XCP-01 is connected to the vacuum pick-up source of these
units. If the unit is intended to work with other system than
SMT-ServiCE the external vacuum source is required. X-KAR units such
as XVP-200, XVP-100, XVB-1 are a good choice. One can also use other
manufacturers vacuum units working quietly and providing vacuum of
200mmHg or more.
 |
| XCP-01 |
XCP-01 Includes:
- XCP-01A arm assembly with clamp, which fits all X-KAR bases
- XSK-1 short column. This column fits all X-KAR Base Units
- Spring Loaded Head XSPL-1
- Conductive silicon vacuum line XCSV-1
- XCP-P1 Vacuum Cup Protector Set
- AVP-VC set - Vacuum Pick up cup set (3 pcs)
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Part Number |
Description |
Price
USD
|
| XCP-01 |
|
XCP-01 |
Semi-automatic Unique Vacuum Pick-up Tool |
|
