PowerQuad®
QFP Quad Flat Pack
The QFP PowerQuad® 2 (PQ2) is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. The IC is attached directly to this large, highly efficient heatsink, which readily extracts generated heat under demand situations.
The large heatsink also provides a “floating” ground plane to the signal leads, reducing self-inductance by 50% (over conventional plastic QFPs). Additionally, the patented PQ2 heatsink has integrated mechanical “locking” features to ensure package integrity while eliminating moisture penetration.
QFP PowerQuad 2QFP |
Part Number | Number of Pins |
Body Pitch |
Lead Pitch |
Footprint | Quantity Per Tray |
Tape Width |
Tape Pitch |
Quantity Per Reel |
A-PQ2-QFP80-14X20mm-.8mm-3.2 | 80 | 14 x 20mm | .8mm | 3.2mm | 50/66 | 44mm | 32mm | 350 |
A-PQ2-QFP80-14X20mm-.8mm-3.9 | 80 | 14 x 20mm | .8mm | 3.9mm | 50/66 | 44mm | 32mm | 350 |
A-PQ2-QFP100-14X20mm-.65mm-3.2 | 100 | 14 x 20mm | .65mm | 3.2mm | 50/66 | 44mm | 32mm | 200 |
A-PQ2-QFP100-14X20mm-.65mm-3.9 | 100 | 14 x 20mm | .65mm | 3.9mm | 50/66 | 44mm | 32mm | 200 |
A-PQ2-QFP120-28mm-.8mm-3.2 | 120 | 28mm sq | .8mm | 3.2mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP128-14X20mm-.5mm-3.2 | 128 | 14 x 20mm | .5mm | 3.2mm | 66 | 44mm | 32mm | 200 |
A-PQ2-QFP128-14X20mm-.5mm-3.9 | 128 | 14 x 20mm | .5mm | 3.9mm | 66 | 44mm | 32mm | 200 |
A-PQ2-QFP128-28mm-.8mm-3.2 | 128 | 28mm sq | .8mm | 3.2mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP144-28mm-.65mm-3.2 | 128 | 28mm sq | .65mm | 3.2mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP160-28mm-.65mm-3.2 | 160 | 28mm sq | .65mm | 3.2mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP208-28mm-.5mm-2.6 | 208 | 28mm sq | .5mm | 2.6mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP240-32mm-.5mm-2.6 | 240 | 32mm sq | .5mm | 2.6mm | 24 | — | — | — |
A-PQ2-QFP256-28mm-.4mm-2.6 | 256 | 28mm sq | .4mm | 2.6mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP256-28mm-.4mm-3.2 | 256 | 28mm sq | .4mm | 3.2mm | 24 | 44mm | 40mm | 200 |
A-PQ2-QFP304-40mm-.5mm-2.6 | 304 | 40mm sq | .5mm | 2.6mm | 12 | — | — | — |
- Very high conductive, solid copper heatsink.
- 50% reduction in package self-inductance.
- 80 – 304 lead counts (14 x 20mm to 40 x 40mm body size).
- Industry-accepted JEDEC package outlines.
- Available in “THIN” LQFP formats.
- Low stress mold compound.
- Heatsink-up and heatsink-down configurations available.
- ~100% improvement in Theta JA over standard QFP.