8101

PBGA Plastic Ball Grid Array

PBGA 1.0mm Pitch

PBGA 1.5mm/1.27mm Pitch

PBGA packages are designed for low inductive, improved thermal operation and enhanced SMT ability. PBGA packages are ideal for microprocessors/controllers, ASICs, gate arrays, memory, DSPs and PC chip set applications. PBGA packages consist of a BT (Bismaleimide-Triazine) substrates with eutectic (63/37) solder balls attached. Solder ball pitches are 1.0mm, 1.27m and 1.5mm. Solder Ball patterns can come perimeter, staggered or full ball array. Body sizes can range from 13mm to 45mm. PBGAs are JEDEC standard outlines

Amkor PBGA
BGA Variable Pitch/Array Kit
BGA Global Daisy-Chain Kit
Solder Practice Board/Kit

Part Number	I/O Count	Pitch	Body Size	Ball Matrix	Ball Alignment	Quantity Per Tray
PBGA144-1.0mm-13mm	144	1.0mm	13mm	12 x 12	Full Grid	160
PBGA156-1.0mm-15mm	156	1.0mm	15mm	14 x 14	Perimeter	126
PBGA160-1.0mm-15mm	160	1.0mm	15mm	14 x 14	Perimeter	126
PBGA196-1.0mm-15mm	196	1.0mm	15mm	14 x 14	Full Grid	126
PBGA208-1.0mm-17mm	208	1.0mm	17mm	16 x 16	Perimeter	90
PBGA256-1.0mm-17mm	256	1.0mm	17mm	16 x 16	Full Grid	90
PBGA288-1.0mm-23mm	288	1.0mm	23mm	22 x 22	Perimeter	60
PBGA324-1.0mm-23mm	324	1.0mm	23mm	22 x 22	Perimeter	60

Overall thickness of 1.0mm pitch PBGA packages will vary in size (please call for more details).
Parts are packaged in JEDEC trays.
Call for tape and reel quantity and availability.
Solder ball material is eutectic 63/37 SnPb.
Some components are daisy-chained (please call for more details).

Daisy-chained connections are connections between I/O (input/output) of the component.
BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.
Parts can be baked and dry-packed.

Drawing PBGA169-1.5mm-23mm 169 1.5mm 23mm 13 x 13 Full Grid 60 Drawing PBGA225-1.5mm-27mm 225 1.5mm 27mm 15 x 15 Full Grid 40 Drawing PBGA256-1.27mm-27mm 256 1.27mm 27mm 20 x 20 Perimeter 40 Drawing PBGA272-1.27mm-27mm 272 1.27mm 27mm 20 x 20 Perimeter 40 Drawing PBGA292-1.27mm-27mm 292 1.27mm 27mm 20 x 20 Perimeter 40 Drawing PBGA313-1.27mm-35mm 313 1.27mm 35mm 25 x 25 Stagger 24 Drawing PBGA324-1.27mm-27mm 324 1.27mm 27mm 20 x 20 Perimeter 40 Drawing PBGA352-1.27mm-35mm 352 1.27mm 35mm 26 x 26 Perimeter 24 Drawing PBGA388-1.27mm-35mm 388 1.27mm 35mm 26 x 26 Perimeter 24 Drawing PBGA420-1.27mm-35mm 420 1.27mm 35mm 26 x 26 Perimeter 24 Drawing PBGA480-1.27mm-35mm 480 1.27mm 35mm 26 x 26 Perimeter 24 PBGA676-1.27mm-35mm 676 1.27mm 35mm 26 x 26 Full Grid 24

Parts are packaged in JEDEC-trays.
Call for tape and reel quantity and availability.
Solder ball material is eutectic 63/37 SnPb.
Daisy-chain connections are connections between I/O (input/output) of the component.
BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.

Daisy-chain connections are used, paired with a PC board that has complimentary connections between pads in order to test for continuity.
Parts can be baked and dry-packed.
Most PBGA packages are assembled with “dummy” die to simulate the CTE of live parts.
Some components are daisy-chained (please call for more details).

PBGA Plastic Ball Grid Array

Amkor PBGA BGA Variable Pitch/Array Kit BGA Global Daisy-Chain Kit Solder Practice Board/Kit

Amkor PBGA
BGA Variable Pitch/Array Kit
BGA Global Daisy-Chain Kit
Solder Practice Board/Kit