X-106 Full Convection Mini Oven 
Especially designed for Re-Balling and LEAD FREE Soldering of boards up to size 6”x 4.7”.
Model X-106 AC incorporates fast cooling to solidify molten solder in 60 seconds or less.
The X-106 MiniOven was designed primarily for even, through convection fast heating of the IC’s during re-balling. It provides full profiling, nitrogen environment and exceptionally accurate process control. With the operating mode bd-t (object or board temperature control), the oven will deliver hot air or nitrogen to achieve desired temperatures of the surface where the thermocouple is attached.
TECHNICAL SPECIFICATIONS
|
Input Voltages |
220-240V AC 50/60 Hz 110-120V AC 50/60 Hz |
|
Power Consumption |
1800W |
|
Fuse |
8A for 220-240V, 16A for 110-120V |
|
Heater Control |
PID, Closed-Loop Thermocouple sensor feedback |
|
Reflow area |
160x120x40 mm (6.3”x4.7”x1.57”) |
|
Temperature range |
30 ºC – 350 ºC (86 ºF – 662 ºF) |
|
Temperature Zones |
Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones |
|
Heaters |
2 Heaters (Front and Rear) 1.0kW programmed independently |
|
Max. PCB size |
160 x 160 mm (6” x 6”) |
|
Communication with PC |
RS485 port ( XKAR X485-USB converter required to connect to PC USB port) |
|
Weight |
8kg (17.7 lbs.) |
|
System dimensions |
440mm x 225mm x 210mm (17.3” x 8.8” x 8.3”) |
|
Packaged weight |
10kg (22.1 lbs.) |
Instruction Manual - Download
X-106AC-MiniOven_Error-code
 |
Part Number | Description | Price USD |
||||
|---|---|---|---|---|---|---|---|
| X-106AC MiniOven-120V | Full Convection Mini Oven with N2 input for reflow of small boards and Re-balling. Has built-in accelerated cooling by shop air or N2. Basic Model without fast cooling- price 1889.90 |
|