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ePad™ TSSOP
ExposedPad™ Thin Shrink
Small Outline Package

ExposedPad™ TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages, which can increase heat dissipation by as much as 150%.

ExposedPad TSSOP Photo
Also see...
TSSOP
Part Number Number
of Pins
Body
Width
Pitch Tape
Width
Tape
Pitch
Quantity
Per Tube
Quantity
Per Reel
A-ePadTSSOP8T-4.4mm 8 4.4mm .65mm 12/16mm 8mm 100 1,000/2,500
A-ePadTSSOP14T-4.4mm 14 4.4mm .65mm 12/16mm 8mm 96 1,000/2,500
A-ePadTSSOP16T-4.4mm 16 4.4mm .65mm 12/16mm 8mm 96 1,000/2,500
A-ePadTSSOP20T-4.4mm 20 4.4mm .65mm 16mm 8/12mm 74 1,000/2,500
A-ePadTSSOP28T-4.4mm 28 4.4mm .65mm 16mm 8/12mm 50 1,000/2,500
A-ePadTSSOP28T-6.1mm 28 6.1mm .65mm 24mm 12mm 50 1,000
A-ePadTSSOP56T-6.1mm 56 6.1mm .50mm 24mm 12mm 35 1,000
  • Solder plated exposed metal die pad.
  • Highly conductive copper leadframe.
  • Up to 60% improvement in Theta JA (compared to standard TSSOP).
  • Standard body thickness is 0.90mm.
  • Overall height is 1.1mm
  • Tube quantity may vary.
  • Tape type is plastic.

ExposedPad Cross-Section Drawing

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