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CTBGA ChipArray®
Thin Core Ball Grid Array

Also See ...
Flip Chip
Part Number I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray
.5mm Pitch            
A-CTBGA40-.5mm-5mm* 40 .5mm 5mm 8 x 8 Perimeter 792
A-CTBGA48-.5mm-5mm 48 .5mm 5mm 8 x 8 Perimeter 792
A-CTBGA56-.5mm-6mm* 56 .5mm 6mm 10 x 10 Perimeter 608
A-CTBGA60-.5mm-5mm* 60 .5mm 5mm 8 x 8 Perimeter 792
A-CTBGA64-.5mm-6mm 64 .5mm 6mm 10 x 10 Perimeter 608
A-CTBGA80-.5mm-7mm 80 .5mm 7mm 12 x 12 Perimeter 476
A-CTBGA84-.5mm-6mm* 84 .5mm 6mm 10 x 10 Perimeter 608
A-CTBGA84-.5mm-7mm* 84 .5mm 7mm 12 x 12 Perimeter 476
A-CTBGA96-.5mm-8mm 96 .5mm 8mm 14 x 14 Perimeter 360
A-CTBGA108-.5mm-7mm* 108 .5mm 7mm 12 x 12 Perimeter 476
A-CTBGA108-.5mm-8mm 108 .5mm 8mm 14 x 14 Perimeter 360
A-CTBGA132-.5mm-8mm* 132 .5mm 8mm 14 x 14 Perimeter 360
.8mm Pitch            
A-CTBGA49-.8mm-6mm* 49 .8mm 6mm 7 x 7 Full Array 608
A-CTBGA49-.8mm-7mm* 49 .8mm 7mm 7 x 7 Full Array 476
A-CTBGA64-.8mm-7mm* 64 .8mm 7mm 8 x 8 Full Array 476
A-CTBGA64-.8mm-8mm* 64 .8mm 8mm 8 x 8 Full Array 360
A-CTBGA81-.8mm-8mm* 81 .8mm 8mm 9 x 9 Full Array 360
A-CTBGA81-.8mm-9mm* 81 .8mm 9mm 9 x 9 Full Array 308
A-CTBGA100-.8mm-9mm 100 .8mm 9mm 10 x 10 Full Array 308
A-CTBGA100-.8mm-10mm* 100 .8mm 10mm 10 x 10 Full Array 250
A-CTBGA128-.8mm-11mm* 128 .8mm 11mm 12 x 12 Perimeter 207
A-CTBGA160-.8mm-12mm* 160 .8mm 12mm 14 x 14 Perimeter 198
A-CTBGA176-.8mm-13mm* 176 .8mm 13mm 15 x 15 Perimeter 160
A-CTBGA192-.8mm-14mm* 192 .8mm 14mm 16 x 16 Perimeter
A-CTBGA208-.8mm-15mm* 208 .8mm 15mm 17 x 17 Perimeter 126
A-CTBGA224-.8mm-13mm 224 .8mm 13mm 15 x 15 Perimeter 160
1.0mm Pitch            
A-CTBGA100-1.0mm-11mm* 100 1.0mm 11mm 10 x 10 Full Array 207
A-CTBGA144-1.0mm-13mm* 144 1.0mm 13mm 12 x 12 Full Array 160

See CTBGA Drawings and Solder Information

  • * = DC Available.
  • Parts are packaged in JEDEC trays when available.
  • Some components are available daisy-chained. Please call for more details.
  • 0.12mm (5 mil) coplanarity.
  • Solder ball material is Eutectic 63/37 SnPb.
  • BT (Bismaleimide-Triazine) substrates or equivalent.
  • Package thickness is 1.2mm max for 0.8mm and1.0mm pitch packages.
  • Package thickness is 1.1mm max for 0.5mm pitch packages.
  • New: CABGA and CTBGA parts are available without solder balls, which makes the package LGA. Please call formore details.
  • Lead-free parts are available.
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