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CABGA ChipArray® Ball Grid Array

ChipArray® packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. Established SMT mounting processes and techniques are compatibly with ChipArray®. The package size and design provides ideal RF operation (low inductance) for high speed applications requiring small footprints.

Also See ...
Flip Chip
BGA Variable Pitch/Array Kit
BGA Fine Pitch Kit
Part Number I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray
.5mm Pitch            
A-CABGA40-.5mm-5mm* 40 .5mm 5mm 8 x 8 Perimeter 624
A-CABGA56-.5mm-6mm* 56 .5mm 6mm 10 x 10 Perimeter 408
A-CABGA84-.5mm-7mm* 84 .5mm 7mm 12 x 12 Perimeter 476
.8mm Pitch            
A-CABGA36-.8mm-6mm* 36 .8mm 6mm 6 x 6 Full Array 608
A-CABGA49-.8mm-7mm* 49 .8mm 7mm 7 x 7 Full Array 476
A-CABGA64-.8mm-8mm* 64 .8mm 8mm 8 x 8 Full Array 360
A-CABGA81-.8mm-9mm* 81 .8mm 9mm 9 x 9 Full Array 308
A-CABGA100-.8mm-9mm 100 .8mm 9mm 10 x10 Full Array 308
A-CABGA100-.8mm-10mm* 100 .8mm 10mm 10 x 10 Full Array 250
A-CABGA128-.8mm-11mm* 128 .8mm 11mm 12 x 12 Perimeter 207
A-CABGA144-.8mm-12mm* 144 .8mm 12mm 13 x 13 Perimeter 198
A-CABGA160-.8mm-12mm* 160 .8mm 12mm 14 x 14 Perimeter 198
A-CABGA176-.8mm-13mm* 176 .8mm 13mm 15 x 15 Perimeter 160
A-CABGA192-.8mm-14mm* 192 .8mm 14mm 16 x 16 Perimeter
A-CABGA208-.8mm-15mm* 208 .8mm 15mm 17 x 17 Perimeter 126
A-CABGA224-.8mm-13mm 224 .8mm 13mm 15 x 15 Full Array 160
A-CABGA256-.8mm-17mm* 256 .8mm 17mm 20 x 20 Perimeter
A-CABGA288-.8mm-19mm* 288 .8mm 19mm 22 x 22 Perimeter
1.0mm Pitch            
A-CABGA64-1.0mm-9mm 64 1.0mm 9mm 8 x 8 Full Array 308
A-CABGA81-1.0mm-10mm 81 1.0mm 10mm 9 x 9 Full Array 250
A-CABGA100-1.0mm-11mm* 100 1.0mm 11mm 10 x 10 Full Array 207
A-CABGA121-1.0mm-12mm* 121 1.0mm 12mm 11 x 11 Full Array 198
A-CABGA144-1.0mm-13mm* 144 1.0mm 13mm 12 x 12 Full Array 160
A-CABGA169-1.0mm-14mm* 169 1.0mm 14mm 13 x 13 Full Array
A-CABGA196-1.0mm-15mm* 196 1.0mm 15mm 14 x 14 Full Array 126
A-CABGA256-1.0mm-17mm* 256 1.0mm 17mm 16 x 16 Full Array 90

See CABGA Drawings and Solder Information

  • * = DC Available.
  • Parts are packaged in JEDEC trays when available.
  • Some components are available daisy-chained. Call for details.
  • <0.12mm (5 mil) coplanarity.
  • Solder ball material is Eutectic 63/37 SnPb.
  • BT (Bismaleimide-Triazine) substrates or equivalent.
  • Package thickness is 1.5mm max for 0.8mm and1.0mm pitch packages.
  • Package thickness is 1.34mm max for 0.5mm pitch packages.
  • New: CABGA and CTBGA parts are available withoutsolder balls, which makes the package LGA. Please call for more details.
  • Lead-free parts are available.
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