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TABGA TapeArray™ Ball Grid Array

The TapeArray™ package is a near chip scale (CSP). The package has a die-up, wire bonded configuration with a flexible circuit substrate and an over-molded body. The TapeArray™ expands the existing packaging of the fleXBGA® by streamlining the assembly process into an array strip format.

The package is then singulated by saw as part of the EOL process. The fine line features of the tape substrate offer reduced conductor and wirebond finger pitch to offer the highest I/O density solutions for a wide range of applications.

Amkor TapeArray Photo

Also See ...
BGA Fine Pitch Kits
Part number I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray
.5mm Pitch            
A-TArray48-.5mm-5mm 48 .5mm 5mm 8 x 8 Perimeter
A-TArray64-.5mm-6mm* 64 .5mm 6mm 8 x 8 Full Array 608
A-TArray80-.5mm-7mm 80 .5mm 7mm 12 x 12 Perimeter 476
A-TArray84-.5mm-6mm* 84 .5mm 6mm 10 x 10 Perimeter 608
A-TArray96-.5mm-8mm* 96 .5mm 8mm 14 x 14 Perimeter 360
A-TArray112-.5mm-7mm 112 .5mm 7mm 12 x 12 Perimeter 476
A-TArray132-.5mm-8mm* 132 .5mm 8mm 14 x 14 Perimeter 360
A-TArray228-.5mm-12mm* 228 .5mm 12mm 22 x 22 Perimeter 198
.8mm Pitch            
A-TArray49-.8mm-6mm 49 .8mm 6mm 7 x 7 Full Array 608
A-TArray64-.8mm-8mm 64 .8mm 8mm 8 x 8 Full Array 360
A-TArray81-.8mm-8mm 81 .8mm 8mm 9 x 9 Full Array 360
A-TArray100-.8mm-9mm 100 .8mm 9mm 10 x 10 Full Array 308
A-TArray112-.8mm-10mm* 112 .8mm 10mm 11 x 11 Perimeter 250
A-TArray132-.8mm-12mm* 132 .8mm 12mm 14 x 14 Perimeter 198
A-TArray144-.8mm-10mm* 144 .8mm 10mm 12 x 12 Full Array 250
A-TArray180-.8mm-12mm* 180 .8mm 12mm 14 x 14 Perimeter 198
A-TArray192-.8mm-14mm 192 .8mm 14mm 16 x 16 Perimeter
A-TArray220-.8mm-14mm 220 .8mm 14mm 16 x 16 Perimeter
1.0mm Pitch            
A-TArray-100-1.0mm-11mm 100 1.0mm 11mm 10 x 10 Full Array
A-TArray-256-1.0mm-17mm* 256 1.0mm 17mm 16 x 16 Full Array 90

See TapeArray Cross-Section and Solder Information

  • * = DC Available.
  • Parts are packaged in JEDEC-trays when available.
  • Solder ball material is Eutectic 63/37 SnPb.
  • 48 to 256 ball counts.
  • 5 to 17mm sq. body sizes.
  • 1.1mm mounted height for 1.0mm and 0.8mm ball pitches.
  • 1.0mm mounted height for 0.5mm ball pitch.
  • 1.0, 0.8, and 0.5mm ball pitches.
  • Excellent solder joint reliability.
  • Superior moisture resistance performance.
  • Some components are available daisy-chained. Call for details.
  • JEDEC Compliant
    MO-195 — 0.5mm pitch
    MO-216 — 0.8mm pitch
    MO-192 — 1.0mm pitch
  • Lead-free parts are available.
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