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SBGA SuperBGA®
Super Ball Grid Array 1.27mm

SuperBGA® Package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heat sink. Since the IC and the I/O are on the same side, signal vias are eliminated.

SBGA Photo
Part Number I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray
A-SBGA168-1.27mm-23mm 168 1.27mm 23mm 17 x 17 Perimeter 60
A-SBGA256-1.27mm-27mm 256 1.27mm 27mm 20 x 20 Perimeter 40
A-SBGA304-1.27mm-31mm 304 1.27mm 31mm 23 x 23 Perimeter 27
A-SBGA352-1.27mm-35mm 352 1.27mm 35mm 26 x 26 Perimeter 24
A-SBGA432-1.27mm-40mm 432 1.27mm 40mm 31 x 31 Perimeter 21
A-SBGA520-1.27mm-40mm 520 1.27mm 40mm 31 x 31 Perimeter 21
A-SBGA560-1.27mm-42.5mm 560 1.27mm 42.5mm 33 x 33 Perimeter 12
A-SBGA600-1.27mm-45mm 600 1.27mm 45mm 35 x 35 Perimeter 12
See Cross Section Drawing and Solder Information
  • Superior thermal performance.
  • Light weight
  • Low profile (1.4mm mounted)
  • Moisture resistant (JEDEC level 3)
  • JEDEC MO-192 standard outlines
  • Enhanced electrical performance > 1 GHz
  • Parts are packaged in JEDEC trays.
  • Call for tape and reel quantity and availability.
  • Solder ball material is eutectic 63/37 SnPb.
  • BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
  • Parts can be baked and dry-packed.
  • All components are daisy-chained except for 520 I/O.
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