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PBGA Plastic Ball Grid Array

PBGA 1.0mm Pitch
PBGA 1.5/1.27mm Pitch

Amkor PBGAs incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability.

PBGA Photo

PBGA 1.0mm Pitch

Also see ...
PBGA Dummy Components
BGA Global Daisy-Chain Test Kit
BGA Variable Pitch and Array Kit
Solder Practice Board/Kit
Part Number I/O Count Pitch Body
Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
A-PBGA144-1.0mm-13mm 144 1.0mm 13mm 12 x 12 Full Grid 160
A-PBGA156-1.0mm-15mm 156 1.0mm 15mm 14 x 14 Perimeter 126
A-PBGA160-1.0mm-15mm 160 1.0mm 15mm 14 x 14 Perimeter 126
A-PBGA192-1.0mm-17mm 192 1.0mm 17mm 16 x 16 Perimeter 90
A-PBGA196-1.0mm-15mm 196 1.0mm 15mm 14 x 14 Full Grid 126
A-PBGA208-1.0mm-17mm 208 1.0mm 17mm 16 x 16 Perimeter 90
A-PBGA256-1.0mm-17mm 256 1.0mm 17mm 16 x 16 Full Grid 90
A-PBGA288-1.0mm-23mm 288 1.0mm 23mm 22 x 22 Perimeter 60
A-PBGA289-1.0mm-19mm 289 1.0mm 19mm 17 x 17 Full Array
A-PBGA324-1.0mm-23mm 324 1.0mm 23mm 22 x 22 Perimeter 60
A-PBGA416-1.0mm-27mm 416 1.0mm 27mm 26 x 26 Perimeter 40
A-PBGA456-1.0mm-27mm 456 1.0mm 27mm 26 x 26 Perimeter 40
A-PBGA484-1.0mm-27mm 484 1.0mm 27mm 26 x 26 Perimeter 40
A-PBGA516-1.0mm-31mm 516 1.0mm 31mm 30 x 30 Perimeter 27
A-PBGA580-1.0mm-35mm 580 1.0mm 35mm 34 x 34 Perimeter 24
A-PBGA676-1.0mm-27mm 676 1.0mm 27mm 26 x 26 Full Grid 40
A-PBGA680-1.0mm-35mm 680 1.0mm 35mm 34 x 34 Perimeter 24
A-PBGA928-1.0mm-40mm 928 1.0mm 40mm 39 x 39 Perimeter 21
A-PBGA1156-1.0mm-35mm 1156 1.0mm 35mm 34 x 34 Full Array 24
See PBGA Drawings and Solder Information
  • Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).
  • Parts are packaged in JEDEC trays.
  • Call for tape and reel quantity and availability.
  • Solder ball material is eutectic 63/37 SnPb.
  • All components are daisy-chained.
  • Daisy-chained connections are connections between I/O(input/output) of the component.
  • BT (Bismaleimide-Triazine) substrates.
  • JEDEC MS-034 standard outlines.
  • Ball diameter varies (see chart).
  • BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
  • Lead-free parts are available.

PBGA 1.5/1.27mm Pitch

Part Number I/O Count Pitch Body
Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
A-PBGA119-1.27mm-14x22mm 119 1.27mm 14 x 22mm 7 x 17 Full Grid 96
A-PBGA121-1.27mm-15mm 121 1.27mm 15mm 11 x 11 Full Grid 126
A-PBGA153-1.27mm-14x22mm 153 1.27mm 14 x 22mm 9 x 17 Full Grid 96
A-PBGA208-1.27mm-23mm 208 1.27mm 23mm 17 x 17 Perimeter 90
A-PBGA217-1.27mm-23mm 217 1.27mm 23mm 17 x 17 Perimeter 60
A-PBGA225-1.50mm-27mm 225 1.50mm 27mm 15 x 15 Full Grid 40
A-PBGA249-1.27mm-23mm 249 1.27mm 23mm 17 x 17 Perimeter 60
A-PBGA256-1.27mm-27mm 256 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA272-1.27mm-27mm 272 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA304-1.27mm-31mm 304 1.27mm 31mm 23 x 23 Perimeter 40
A-PBGA313-1.27mm-35mm 313 1.27mm 35mm 25 x 25 Stagger 24
A-PBGA316-1.27mm-27mm 316 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA320-1.27mm-27mm 320 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA329-1.27mm-31mm 329 1.27mm 31mm 23 x 23 Perimeter 27
A-PBGA336-1.27mm-27mm 336 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA348-1.27mm-27mm 348 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA352-1.27mm-35mm 352 1.27mm 35mm 26 x 26 Perimeter 24
A-PBGA356-1.27mm-27mm 356 1.27mm 27mm 20 x 20 Perimeter 40
A-PBGA383-1.27mm-31mm 383 1.27mm 31mm 23 x 23 Perimeter 27
A-PBGA388-1.27mm-35mm 388 1.27mm 35mm 26 x 26 Perimeter 24
A-PBGA420-1.27mm-35mm 420 1.27mm 35mm 26 x 26 Perimeter 24
A-PBGA421-1.27mm-31mm 421 1.27mm 31mm 23 x 23 Perimeter 27
A-PBGA456-1.27mm-35mm 456 1.27mm 35mm 26 x 26 Perimeter 24
A-PBGA524-1.27mm-37.5mm 524 1.27mm 37.5mm 28 x 28 Perimeter 21
A-PBGA564-1.27mm-40mm 564 1.27mm 40mm 30 x 30 Perimeter 24
See PBGA Drawings and Solder Information
  • Parts are packaged in JEDEC trays.
  • Call for tape and reel quantity and availability.
  • Solder ball material is eutectic 63/37 SnPb.
  • All components are daisy-chained.
  • Daisy-chained connections are connections between I/O (input/output) of the component.
  • BT (Bismaleimide-Triazine) substrates.
  • JEDEC MS-034 standard outlines.
  • Ball diameter varies (see chart).
  • BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
  • Lead-free parts are available.
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