SSOP Small Shrink Outline Package
The SSOP package body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC packages. Lead counts range from 8 to 64. Body sizes are 150, 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.
(*) Available as an ExposedPad™ SSOP Package by Amkor. ExposedPad™ can increase heat dissipation by as much as 110% over standard packages.
- Tube quantity may vary.
- Carrier tape is plastic.
- 209 and 300 mil body sizes/
- JEDEC and EIAJ package outline standard compliance.
- High-conductivity copper leadframes.
- Solder plate lead finish