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Flip Chips

FCT Bump Structure

Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection from the die to the exterior of the package. The interconnection between die and carrier in flip chip packaging is made through a conductive bump that is placed directly on the die surface. The bumped die is then flipped over and placed face down, with the bumps connecting to the carrier. After the die is soldered, underfill is applied between the die and the substrate, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the difference in thermal expansion between the silicon die and carrier.

Lead-Free Parts Available

Also see ...
Flip Chip Test Boards
Amkor Stacked CSP
Part Number PB18-
250 x 250
PB18-
500 x 500
FA10-
200 x 200
PB08-
200 x 200
PB08-
400 x 400
PST02-
150 x 150
Drawings See Drawing See Drawing See Drawing See Drawing See Drawing
Die Size 250 x 250 mils 500 x 500 mils 200 x 200 mils 200 x 200 mils
400 x 400 mils
150 x 150 mils
Bump Pitch 457 µm, 18 mil 457 µm, 18 mil 254 µm, 10 mil 203 µm, 8 mil 457 µm, 18 mil
Passivation Via 102 µm 102 µm 80 µm 73 µm 102 µm
UBM Diameter 152 µm 152 µm 102 µm 95 µm 152 µm
Bump Height 140 µm 140 µm 110 µm 98 µm 130 µm
Bump Diameter 190 µm 190 µm 135 µm 120 µm 160 µm
No. of Bumps 48 96 317 88 21
Max. Bump Diagonal 7.7 mm 16.5 mm 7.9 mm  —
Die Metal Pad Size 193 x 193 µm 193 x 193 µm 127 x 127 µm 115 x 115 µm 165 x 165 µm
Thickness 12 kA 12 kA 12 kA 12 kA 40 kA
Type 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si
Packaging
Uncut Wafer* 5" Wafer
250 x 250 mils
(236 Die)
5" Wafer
500 x 500 mils
(46 Die)
5" Wafer
200 x 200 mils
(375 Die)
5" Wafer
200 x 200 mils
(375 Die)
400 x 400 mils
(87 Die)
5" Wafer
150 x 150 mils
(694 Die)
Tray Sawed 5" Wafer
25 per tray 2" sq
Waffle Pack
Sawed 5" Wafer
9 per tray 2" sq
Waffle Pack
Sawed 5" Wafer
36 per tray
200 x 200
Waffle Pack
Sawed 5" Wafer
36 per tray
200 x 200
9 per tray
400 x 400
Waffle Pack
Sawed 5" Wafer
25 per tray 2" sq
Waffle Pack
Tape and Reel Call For Availability Call For Availability Call For Availability Call For Availability Call For Availability
  • * Die count represents expected yield per wafer.
  • All die is packaged in waffle pack trays unless otherwise specified.
  • All test wafers are currently 5" diameter and are 0.635mm thick. Passivation is one-micron thick plasma nitride with round via openings.
  • The potential multiple is the number of die repeats on the wafer. With the wafer orientated flat down, a right hand coordinate system applies.
  • Die size is from scribe line to center-to-center. Scribe width is 0.05mm passivated. Each bump is electrically connected to one other bump and isolated from all others to facilitate electrical test.
  • Bump pitch is defined as center-to-center distance between passivation openings.
  • Bump height is defined as silicon surface to the top of the bump.
  • Bump diameter is defined as the maximum diameter.
  • UBM = Under Bump Metallurgy
  • Lead-free parts are available.

About Lead-Free Flip Chips

Flip Chips are used in evaluating assembly techniques, board continuity, temperature cycle life test evaluation, underfill processes and other generic Flip Chip evaluations. When using Lead-Free Flip Chips, consideration needs to be given to the appropriate flux, underfill, temperature profile, and pad finish for the assembly. Many companies are developing and qualifying alternative pad finishes such as immersion Sn. Lead-Free Flip Chips address the need for environmentally conscious assemblies as well as Alpha particle tolerant packaging.

Lead-Free Die

  • All Flip Chips are available Lead-Free with Alloy LF2 composition 95.5% Sn /3.5% Ag /1.0% Cu.
  • When ordering Lead-Free Flip Chips, add “LF2” at end of part number.
  • LF2 was introduced by FCT (the acronym is Lead-Free #2). Please call for more details.

Quartz Die

  • When ordering Quartz chips, add “Q” at end of part number. For Quartz Lead-Free add “QLF2”.
  • Quartz allows customers to observe underfill processes. Please call for more details.
  • All Flip Chips are available in “Quartz” with eutectic solder bumps or Lead-Free.
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