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µBGA® Micro Ball Grid Array

The µBGA® package is a chip scale package. A polyimide film and metal layer tape form the interconnect leads for the package. The package is attached to the tape by a low stress elastomeric adhesive. The leads are bonded from the tape in an “s” shape to chip bond pads. A low stress encapsulate covers the bond leads, and eutectic solder balls are attached to pads on the tape.

µBGA Micro Ball Grid Array
µBGA Micro Ball Grid Array Lead-Free

Also see ...
µBGA Test Boards

µBGA® Micro Ball Grid Array

Drawings Part Number I/O Count Pitch Body
Size
Drawing TV-46A 46 .75mm 5.76 x 7.87mm
Drawing TV-62A 62 .8mm 9.3 x 11.5mm
TV-62 Tape 62 .8mm 9.3 x 11.5mm
Drawing TV-74A 74 .75mm 8.17 x 12.7mm
TV-74 Tape 74 .75mm 8.17 x 12.7mm
Drawing TV-208A 208 .5mm 9.28mm sq
TV-208 Tape 208 .5mm 9.28mm sq
  TV-256A 92 .8mm 9.5 x 16.5mm
TV-256 Tape 92 .8mm 9.5 x 16.5mm
  • Parts are packaged in waffle trays.
  • Parts have eutectic 63/37 SnPb solder bumps.
  • Parts are daisy-chained.
  • Call for tape and reel quantity and availability.
  • TV-256 is a 256Mb RDRAM® device in a chip scale package.
  • Moisture sensitivity classification JEDEC level 1.

µBGA® Micro Ball Grid Array Lead-Free

Drawing Part Number I/O Count Pitch Body
Size
Drawing TV-46A Sn/Ag 46 .75mm 5.76 x 7.87mm
TV-46A Sn/Ag/Cu 46 .75mm 5.76 x 7.87mm
Drawing TV-62A Sn/Ag 62 .8mm 9.3 x 11.5mm
TV-62A Sn/Ag/Cu 62 .8mm 9.3 x 11.5mm
TV-62 Tape Sn/Ag 62 .8mm 9.3 x 11.5mm
TV-62 Tape Sn/Ag/Cu 62 .8mm 9.3 x 11.5mm
Drawing TV-74A Sn/Ag 74 .75mm 8.17 x 12.7mm
TV-74A Sn/Ag/Cu 74 .75mm 8.17 x 12.7mm
TV-74 Tape Sn/Ag 74 .75mm 8.17 x 12.7mm
TV-74 Tape Sn/Ag/Cu 74 .75mm 8.17 x 12.7mm
Drawing TV-208A Sn/Ag 208 .5mm 9.28mm sq
TV-208A Sn/Ag/Cu 208 .5mm 9.28mm sq
TV-208 Tape Sn/Ag 208 .5mm 9.28mm sq
TV-208 Tape Sn/Ag/Cu 208 .5mm 9.28mm sq
  TV-256A Sn/Ag 92 .8mm 9.5 x 16.5mm
TV-256A Sn/Ag/Cu 92 .8mm 9.5 x 16.5mm
TV-256 Tape Sn/Ag 92 .8mm 9.5 x 16.5mm
TV-256 Tape Sn/Ag/Cu 92 .8mm 9.5 x 16.5mm
  • There are two lead-free alloys available:
    96.5% Sn / 3.5% Ag (tin/silver)
    96.5% Sn / 3.0% Ag / 0.5% Cu (tin/silver/copper)
  • Lead-free application notes available upon request.
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