µBGA® Micro Ball Grid Array
The µBGA® package is a chip scale package. A polyimide film and metal layer tape form the interconnect leads for the package. The package is attached to the tape by a low stress elastomeric adhesive. The leads are bonded from the tape in an “s” shape to chip bond pads. A low stress encapsulate covers the bond leads, and eutectic solder balls are attached to pads on the tape.
µBGA Test Boards
|Drawings||Part Number||I/O Count||Pitch||Body
|Drawing||TV-46A||46||.75mm||5.76 x 7.87mm|
|Drawing||TV-62A||62||.8mm||9.3 x 11.5mm|
|TV-62 Tape||62||.8mm||9.3 x 11.5mm|
|Drawing||TV-74A||74||.75mm||8.17 x 12.7mm|
|TV-74 Tape||74||.75mm||8.17 x 12.7mm|
|TV-208 Tape||208||.5mm||9.28mm sq|
|TV-256A||92||.8mm||9.5 x 16.5mm|
|TV-256 Tape||92||.8mm||9.5 x 16.5mm|
- Parts are packaged in waffle trays.
- Parts have eutectic 63/37 SnPb solder bumps.
- Parts are daisy-chained.
- Call for tape and reel quantity and availability.
- TV-256 is a 256Mb RDRAM® device in a chip scale package.
- Moisture sensitivity classification JEDEC level 1.
|Drawing||Part Number||I/O Count||Pitch||Body
|Drawing||TV-46A Sn/Ag||46||.75mm||5.76 x 7.87mm|
|TV-46A Sn/Ag/Cu||46||.75mm||5.76 x 7.87mm|
|Drawing||TV-62A Sn/Ag||62||.8mm||9.3 x 11.5mm|
|TV-62A Sn/Ag/Cu||62||.8mm||9.3 x 11.5mm|
|TV-62 Tape Sn/Ag||62||.8mm||9.3 x 11.5mm|
|TV-62 Tape Sn/Ag/Cu||62||.8mm||9.3 x 11.5mm|
|Drawing||TV-74A Sn/Ag||74||.75mm||8.17 x 12.7mm|
|TV-74A Sn/Ag/Cu||74||.75mm||8.17 x 12.7mm|
|TV-74 Tape Sn/Ag||74||.75mm||8.17 x 12.7mm|
|TV-74 Tape Sn/Ag/Cu||74||.75mm||8.17 x 12.7mm|
|Drawing||TV-208A Sn/Ag||208||.5mm||9.28mm sq|
|TV-208A Sn/Ag/Cu||208||.5mm||9.28mm sq|
|TV-208 Tape Sn/Ag||208||.5mm||9.28mm sq|
|TV-208 Tape Sn/Ag/Cu||208||.5mm||9.28mm sq|
|TV-256A Sn/Ag||92||.8mm||9.5 x 16.5mm|
|TV-256A Sn/Ag/Cu||92||.8mm||9.5 x 16.5mm|
|TV-256 Tape Sn/Ag||92||.8mm||9.5 x 16.5mm|
|TV-256 Tape Sn/Ag/Cu||92||.8mm||9.5 x 16.5mm|
- There are two lead-free alloys available:
96.5% Sn / 3.5% Ag (tin/silver)
96.5% Sn / 3.0% Ag / 0.5% Cu (tin/silver/copper)
- Lead-free application notes available upon request.