Bomir online Worldwide Distribution Network For SMT, LVA, and ESD Equipment View Shopping Cart USA
Phone: 570 842-4725
Fax: 570 842-4290
Cart: (Empty)

PBGA Plastic Ball Grid Array

PBGA 1.0mm Pitch
PBGA 1.5mm/1.27mm Pitch

PBGA packages are designed for low inductive, improved thermal operation and enhanced SMT ability. PBGA packages are ideal for microprocessors/controllers, ASICs, gate arrays, memory, DSPs and PC chip set applications. PBGA packages consist of a BT (Bismaleimide-Triazine) substrates with eutectic (63/37) solder balls attached. Solder ball pitches are 1.0mm, 1.27m and 1.5mm. Solder Ball patterns can come perimeter, staggered or full ball array. Body sizes can range from 13mm to 45mm. PBGAs are JEDEC standard outlines

PBGA 352

PBGA — Plastic Ball Grid Array (1.0mm Pitch)

Also See ...
Amkor PBGA
BGA Variable Pitch/Array Kit
BGA Global Daisy-Chain Kit
Solder Practice Board/Kit
Part Number I/O
Count
Pitch Body
Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
PBGA144-1.0mm-13mm 144 1.0mm 13mm 12 x 12 Full Grid 160
PBGA156-1.0mm-15mm 156 1.0mm 15mm 14 x 14 Perimeter 126
PBGA160-1.0mm-15mm 160 1.0mm 15mm 14 x 14 Perimeter 126
PBGA196-1.0mm-15mm 196 1.0mm 15mm 14 x 14 Full Grid 126
PBGA208-1.0mm-17mm 208 1.0mm 17mm 16 x 16 Perimeter 90
PBGA256-1.0mm-17mm 256 1.0mm 17mm 16 x 16 Full Grid 90
PBGA288-1.0mm-23mm 288 1.0mm 23mm 22 x 22 Perimeter 60
PBGA324-1.0mm-23mm 324 1.0mm 23mm 22 x 22 Perimeter 60
  • Overall thickness of 1.0mm pitch PBGA packages will vary in size (please call for more details).
  • Parts are packaged in JEDEC trays.
  • Call for tape and reel quantity and availability.
  • Solder ball material is eutectic 63/37 SnPb.
  • Some components are daisy-chained (please call for more details).
  • Daisy-chained connections are connections between I/O (input/output) of the component.
  • BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.
  • Parts can be baked and dry-packed.

PBGA — Plastic Ball Grid Array (1.5mm/1.27mm)

Drawing Part Number I/O
Count
Pitch Body
Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
  PBGA121-1.27mm-15mm 121 1.27mm 15mm 11 x 11 Full Grid 126
 Drawing PBGA169-1.5mm-23mm 169 1.5mm 23mm 13 x 13 Full Grid 60
 Drawing PBGA225-1.5mm-27mm 225 1.5mm 27mm 15 x 15 Full Grid 40
 Drawing PBGA256-1.27mm-27mm 256 1.27mm 27mm 20 x 20 Perimeter 40
 Drawing PBGA272-1.27mm-27mm 272 1.27mm 27mm 20 x 20 Perimeter 40
 Drawing PBGA292-1.27mm-27mm 292 1.27mm 27mm 20 x 20 Perimeter 40
 Drawing PBGA313-1.27mm-35mm 313 1.27mm 35mm 25 x 25 Stagger 24
 Drawing PBGA324-1.27mm-27mm 324 1.27mm 27mm 20 x 20 Perimeter 40
 Drawing PBGA352-1.27mm-35mm 352 1.27mm 35mm 26 x 26 Perimeter 24
 Drawing PBGA388-1.27mm-35mm 388 1.27mm 35mm 26 x 26 Perimeter 24
 Drawing PBGA420-1.27mm-35mm 420 1.27mm 35mm 26 x 26 Perimeter 24
 Drawing PBGA480-1.27mm-35mm 480 1.27mm 35mm 26 x 26 Perimeter 24
  PBGA676-1.27mm-35mm 676 1.27mm 35mm 26 x 26 Full Grid 24
  • Parts are packaged in JEDEC-trays.
  • Call for tape and reel quantity and availability.
  • Solder ball material is eutectic 63/37 SnPb.
  • Daisy-chain connections are connections between I/O (input/output) of the component.
  • BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.
  • Daisy-chain connections are used, paired with a PC board that has complimentary connections between pads in order to test for continuity.
  • Parts can be baked and dry-packed.
  • Most PBGA packages are assembled with “dummy” die to simulate the CTE of live parts.
  • Some components are daisy-chained (please call for more details).
  |  Print page