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Logo X-KARX-REFLOW305 HT-LF Full Convection,
Bench Top, Batch oven with Nitrogen Connections

Especially designed for LEAD FREE Soldering

High performance, inexpensive reflow batch oven for use in small lot production and laboratory simulation tests.

The X-REFLOW is a high performance reflow batch oven designed for reflow simulation, heat-resistant testing and small lot production.

With its large back light LCD display the setting of the temperature and time or the operation, can be easily checked by numerical value or graph.

CE Mark X-REFLOW305 - Full Convection Bench Top Batch Oven with Nitrogen facility
Lead Free

FEATURES

  • HIGH OPERATING TEMPERATURE for LEAD FREE SOLDERING
    Higher than other ovens max. operating temperature 350 °C (662 °F) and better, stronger materials to assure good performance when soldering with lead free alloys
  • HIGH PERFORMANCE, INEXPENSIVE
    The X-REFLOW305 HT-LF is an inexpensive high performance production reflow batch oven. This unit has several unique features, which enhance operation and provide the use with every possible aid.
  • SMALL DESKTOP SIZE
    It has a small foot print and weights only 43kg. Conventional ovens are large in size, but the X-REFLOW305 HT-LF can fit on top of one desk in a small room.
  • LARGE GLASS VIEWING WINDOW
    The large glass viewing window 280x280 mm allows the inside reflow condition to be checked easily. Users can see the oven's inside directly, check and photograph the detail soldering condition by using a microscope, a small CCD camera.
  • LARGE BACK LIGHT LCD DISPLAY WITH DIGITAL AND GRAPHIC PROFILE INFORMATION
    The large back light LCD display allows easy inputting and checking of the profile. One button can change the operation temperature profile on the graph display and allows checking of the operation conditions at a glance. Depending on the working area the LCD display brightness can be adjusted by the contrast adjustment knob making is easy to see.
  • CAPACITY TO STORE UP TO 255 PROFILES
    The four operation processes, preheat 1-3 and reflow, temperature and time are set separately, allowing up to 255 profiles to be stored. To adapt to the PCB size and mounting density, control temperature of the front and back hot wind output opening can be adjusted. The reflow of multi layer PCBs can be done for various small lot production.
  • TIME ZONE LED (OPERATION LAMP)
    The front side time zone LEDs allow operation to be checked at a glance.
  • N2 PORT
    To decrease the oxidation of leads and pads during soldering, compressed N2 gas source can be connected to the oven to replace the air (oxygen).
  • MANAGEMENT KEY
    This oven has a management key. If this key is not used, the oven cannot be operated.

Technical Specifications

 

X-REFLOW305 HT-LF
High Temperature and Lead Free

Reflow area

12" x 12" x 1.75"
(305x305x45 mm)

Minimum cooling temperature

150°C

Maximum temperature setting

350°C

Heaters

2 Heaters x 2,4kW Each

Max. PCB size

12" x12" (305x305 mm)

Max current draw

21 A,
230V 50/60 Hz

Size

L=480mm x W=711mm x H=200mm

Weight

88 lbs. (40 kg)

Computer profile control

Allows creation, storage and recall of up to 255

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